示例機型：

DSI-S-TC9212

應用領域Application:

基于硅、碳化硅、GaN等常見半導體材料，開發出的高精度、高效率的針對透光性襯底晶圓的全自動激光內部改質切割設備。

Han's DSI Develop laser internal modification machine specified for semiconductor materials,like Silicon, Silicon Carbide, Gallium Nitride, which is of high precision and high efficiency.

主要特點Main Features:

● 全自動兼容4/6/8/12寸片生產；

Applied for 4,6,8 and 12 inch wafer;

● 采用高效的進口激光器，工藝效果穩定；

High quality laser device and stable process effect;

● 攜帶DRA自動跟隨系統，切深隨片厚實時調整，可兼容±10μm片厚誤差；

Combined with DRA (Dynamic Range Adjustment) system, where the focal point can be dynamically adjusted according to the thickness variation of the material. Compatible with the tolerance of ±10um;

● CCD攜帶紅外成像，具備正、背切功能；

IR Imaging CCD, capable for dicing from both sides;

● 針對小晶粒產品配套真空裂片系統，保證擴膜良率。

Vacuum splitting system specified to micro-chip production, ensure the effect of die-spread.

主要參數 Main Parameters:

實例效果 Sample Effect：