示例機型：DSI-S-TC9212

應用領域Application

基于硅、碳化硅、GaN等常見半導體材料，

開發出的高精度、高效率的針對透光性襯底

晶圓的全自動激光內部改質切割設備。

Han's DSI Develop laser internal modification

machine specified for semiconductor materials,

like Silicon, Silicon Carbide, Gallium Nitride, which is of high precision and high efficiency.

主要特點Main Features

● 全自動兼容4/6/8/12寸片生產；

   Applied for 4,6,8 and 12 inch wafer;

● 采用高效的進口激光器，工藝效果穩定；

   High quality laser device and stable process effect;

● 攜帶DRA自動跟隨系統，切深隨片厚實時調整，可兼容±10μm片厚誤差；

   Combined with DRA (Dynamic Range Adjustment) system, where the focal point can be dynamically adjusted according to the thickness variation of the material. Compatible with the tolerance of ±10um;

● CCD攜帶紅外成像，具備正、背切功能；

   IR Imaging CCD, capable for dicing from both sides;

● 針對小晶粒產品配套真空裂片系統，保證擴膜良率。

   Vacuum splitting system specified to micro-chip production, ensure the effect of die-spread.

主要參數 Main Parameters

實例效果 Sample Effect